M36L0R7050L1 Datasheet | STMicroelectronics

Feature summary - Multi-Chip Package - 1 die of 128 Mbit (8Mb x16, Mux I/O Multiple Bank, Multi-level, Burst) Flash Memory - 1 die of 32 or 64Mbit Mux I/O, Burst Pseudo SRAM Supply voltage - VDDF = VDDP = VDDQF = 1.7 to 1.95V - VPPF = 9V for fast program Electronic signature - Manufacturer Code: 20h - Device Codes (Top Flash Configuration): M36L0R7060U1: 882Eh, M36L0R7050U1: 882Eh - Device Codes (Bottom Flash Configuration) M36L0R7060L1: 882Fh M36L0R7050L1: 882Fh ECOPACK® package - FBGA TFBGA88 (ZAM) 8 x 10mm - - - Dual operations - program/erase in one Bank while read in others - No delay between Read and Write operations Block locking - All blocks locked at power-up - Any bination of blocks can be locked with zero latency - WPF for Block Lock-Down - Absolute Write Protection with VPPF = VSS mon Flash Interface (CFI) - - Flash memory - - Multiplexed address/data Synchronous / asynchronous read - Synchronous Burst Read mode: 66MHz - Random Access: 85ns Synchronous burst read suspend programming time - 10µs typical Word program time using Buffer Enhanced Factory Program mand Memory organization - Multiple Bank Memory Array: 8 Mbit Banks - Parameter Blocks (Top or Bottom location) Security - 64 bit unique device number - 2112 bit user programmable OTP Cells 100,000 program/erase cycles per block - - - - PSRAM Access time: 70ns Synchronous modes: - Synchronous Write: continuous burst - Synchronous Read: continuous burst or fixed length: 4, 8 or 16 Words for 32 Mbit devices or 4, 8,16 or 32 Words for 64 Mbit devices - Maximum Clock Frequency: 83MHz Low power consumption Low power features - Partial Array Self-Refresh (PASR) - Deep Power-Down (DPD) Mode - Automatic Temperature-pensated Self...