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A2U12M12W2-F2
Datasheet
ACEPACK 2 power module, 3‑level topology, 1200 V, 13 mΩ typ. SiC Power MOSFET gen.2 with NTC
ACEPACK 2
S3 G3 D
N
DC+ T2
G1
T1
S1 AC
Features
• 3-level topology • ACEPACK 2 power module
– 13 mΩ of typical RDS(on) each switch – Insulation voltage UL certified of 2.5 kVrms – Integrated NTC temperature sensor – DBC Cu-Al2O3-Cu based – Press fit contact pins
Applications
• DC/DC converter
G4
G2 S2 S4
Description
DC-
This ACEPACK 2 power module represents a leg of a T-type 3-level inverter
GADG240720201013GT topology that integrates the advanced silicon carbide Power MOSFET technology
from STMicroelectronics. This module leverages the innovative properties of the
wide-bandgap SiC material and a high-thermal-performance substrate.