STMicroelectronics EMIF02-MIC03C2
The EMIF02-MIC03C2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The Flip-Chip packaging means the package size is equal to the die size. This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges up to 15 kV.| Part No. | EMIF02-MIC03C2 |
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| Datasheet | EMIF02-MIC03C2 Download |
| Manufacturer |  STMicroelectronics |
| Description | 2 line EMI filter and ESD protection |
| Buy | Stock & Price |
DESCRIPTION
Coated Flip-Chip package (about 20 times real size) Pin configuration (Bump side) Benefits●
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● EMI symmetrical (I/O) low-pass filter High efficiency EMI filter (-35 dB @ 900 MHz) Very low PCB space consumption: 1.07 mm x 1.47 mm Very thin package: 0.695 mm Coating resin on back side and lead free package High efficiency in ESD suppression High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging. 3 2 1 I2 GND O2 O1 I1 A B C Complies with following standards: IEC 61000-4-2 level 4 input pins 15 kV 8 kV level 1 output pins 2 kV 2 kV (air discharge) (contact discharge (air discharge) (contact discharge MIL STD 883G - Method 3015-7 Class 3 November 2006 Rev 1 1/7 Characteristics EMIF02-MIC03C2 1 Characteristics Figure 1. Basic cell configuration Low-pass Filter Input Output Ri/o = 68 Ω Cline = 100 pF GND GND GND Table 1. Symbol Tj Top Tstg Absolute ratings (limiting values) Parameter Maximum junction temperature Operating temperature range Storage temperature range Value 125 -40 to +85 -55 to +150 Unit °C °C °C Table 2.
