EMIF02-MIC03C2 Overview
Key Specifications
Package: FCBGA
Mount Type: Surface Mount
Height: 695 µm
Length: 1.47 mm
Description
The EMIF02-MIC03C2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The Flip-Chip packaging means the package size is equal to the die size.