Datasheet4U Logo Datasheet4U.com

EMIF02-MIC03F2 - EMI filter and ESD protection

General Description

The EMIF02-MIC03F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences.

The EMIF02 Flip-Chip packaging means the package size is equal to the die size.

Key Features

  • EMI symmetrical (I/O) low-pass filter.
  • High efficiency in EMI filtering.
  • Very low PCB space consuming: 1.07 mm x 1.47 mm.
  • Very thin package: 0.65 mm.
  • High efficiency in ESD suppression Datasheet - production data.
  • High reliability offered by monolithic integration.
  • High reducing of parasitic elements through integration and wafer level packaging Complies with the following standards:.
  • IEC 61000-4-2 level 4, on input pins.

📥 Download Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
EMIF02-MIC07F3 EMI filter and ESD protection ST Microelectronics
EMIF01-100 EMI FILTER/TVS ARRAY Protek Devices
EMIF01-150 EMI FILTER/TVS ARRAY Protek Devices
EMIF01-5250SC5 EMI FILTER ST Microelectronics
EMIF010-COM01F2 EMI FILTER INCLUDING ESD PROTECTION ST Microelectronics

Other Datasheets by STMicroelectronics

Part Number Description
EMIF02-MIC03C2 2 line EMI filter and ESD protection
EMIF02-MIC03M6 2-line IPAD EMI filter and ESD protection
EMIF02-MIC01F2 2-line IPAD EMI filter including ESD protection
EMIF02-MIC02F2 2-line IPAD EMI filter and ESD protection
EMIF02-MIC02F3 EMI filter including ESD protection

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
EMIF02-MIC03F2 2-line IPAD™, EMI filter and ESD protection Flip-Chip package Figure 1. Pin configuration (bump side) and basic cell configuration 321 I2 I1 A GND B O2 O1 C Input Low-pass Filter GND GND Output Ri/o = 68 Ω Cline = 100 pF GND Features • EMI symmetrical (I/O) low-pass filter • High efficiency in EMI filtering • Very low PCB space consuming: 1.07 mm x 1.47 mm • Very thin package: 0.