EMIF02-SPK01C2 Overview
Key Specifications
Package: FCBGA
Mount Type: Surface Mount
Height: 695 µm
Length: 1.47 mm
Description
The EMIF02-SPK01C2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The Flip-Chip packaging means the package size is equal to the die size.
Key Features
- EMI symmetrical (I/O) low-pass filter so
- High efficiency EMI filter (-33 dB @ 900 MHz) b
- Very low PCB space consumption: O 1.07 mm x 1.47 mm )
- Very thin package: 0.670 mm t(s
- Coating resin on back side and lead free c package u
