STMicroelectronics EMIF02-SPK01C2
The EMIF02-SPK01C2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The Flip-Chip packaging means the package size is equal to the die size. This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges up to 15 kV.| Part No. | EMIF02-SPK01C2 |
|---|---|
| Datasheet | EMIF02-SPK01C2 Download |
| Manufacturer |  STMicroelectronics |
| Description | EMI filter including ESD protection |
| Buy | Stock & Price |
APPLICATIONS
Where EMI filtering in ESD sensitive equipment is ct(s) Coated Flip-Chip package te ProduFEATURES
le● EMI symmetrical (I/O) low-pass filter so
● High efficiency EMI filter (-33 dB @ 900 MHz) b
● Very low PCB space consumption: O 1.07 mm x 1.47 mm ) -
● Very thin package: 0.670 mm t(s
● Coating resin on back side and lead free c package u
● High efficiency in ESD suppression rod
● High reliability offered by monolithic integration P
● High reduction of parasitic elements through te integration and wafer level packaging. le Complies with the following standards: so
● IEC 61000-4-2 level 4, on input pins: Ob– 15 kV (air discharge) required:
● Mobile phones and communication systems
● Computers and printers and MCU Boards
DESCRIPTION
Figure 1. Pin configuration (bump side) 321 I2 I1 A GND B O2 O1 C Figure 2. Basic cell configuration – 8 kV (contact discharge) Low-pass Filter● IEC 61000-4-2 Level 1, on output pins: Input – 2 kV (air discharge) – 2 kV (contact discharge) Outp...
