STMicroelectronics EMIF02-SPK01F2
The EMIF02-SPK01 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 Flip-Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV.| Part No. | EMIF02-SPK01F2 |
|---|---|
| Datasheet | EMIF02-SPK01F2 Download |
| Manufacturer |  STMicroelectronics |
| Description | EMI filter and ESD protection |
| Buy | Stock & Price |
FEATURES
● EMI symmetrical (I/O) low-pass filter )● High efficiency in EMI filtering t(s
● Very low PCB space consuming: c 1.07 mm x 1.47 mm u
● Very thin package: 0.65 mm rod
● High efficiency in ESD suppression P
● High reliability offered by monolithic integration te
● High reducing of parasitic elements through le integration and wafer level packaging so Complies with the following standards: b
● IEC 61000-4-2 level 4, on output pins: - O – 15 kV (air discharge) ) – 8 kV (contact discharge) t(s
● IEC 61000-4-2 Level 1, on input pins: c – 2 kV (air discharge) du – 2 kV (contact discharge) ro
● MIL STD 883E - Method 3015-6 Class 3 te P
APPLICATIONS
le Where EMI filtering in ESD sensitive equipment is so required: Ob● Mobile phones and communication systems Flip-Chip package (5 bumps) Figure 1. Pin configuration (bump side) 321 I2 I1 A GND B O2 O1 C Figure 2. Input Basic cell configuration Low-pass Filter Output Ri/o = 10 Ω Cline = 200 pF GND GND GND● Computers, printers and MCU Boards
DESCRIPTION
TM: IPAD is a trademark of STMicroelectronics.
