EMIF02-SPK01F2 Overview
Key Specifications
Package: FCBGA
Mount Type: Surface Mount
Height: 650 µm
Length: 1.07 mm
Description
The EMIF02-SPK01 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 Flip-Chip packaging means the package size is equal to the die size.
Key Features
- EMI symmetrical (I/O) low-pass filter )
- High efficiency in EMI filtering t(s
- Very low PCB space consuming: c 1.07 mm x 1.47 mm u
- Very thin package: 0.65 mm rod
- High efficiency in ESD suppression P
