M36W0R6040B0 Description
TFBGA Connections (Top view through package) . 6 Address Inputs (A0-A19).
M36W0R6040B0 Key Features
- MULTI-CHIP PACKAGE
- 1 die of 64 Mbit (4Mb x 16) Flash Memory
- 1 die of 16 Mbit (1Mb x 16) Pseudo SRAM SUPPLY VOLTAGE
- VDDF = VDDP = VDDQ = 1.7V to 1.95V LOW POWER CONSUMPTION ELECTRONIC SIGNATURE
- Manufacturer Code: 20h
- Device Code (Top Flash Configuration), M36W0R6040T0: 8810h
- Device Code (Bottom Flash Configuration), M36W0R6040B0: 8811h PACKAGES
- pliant with Lead-Free Soldering Processes
- Lead-Free Versions
- PROGRAMMING TIME