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K4S280832B

Manufacturer: Samsung Electronics

K4S280832B datasheet by Samsung Electronics.

K4S280832B datasheet preview

K4S280832B Datasheet Details

Part number K4S280832B
Datasheet K4S280832B_SamsungElectronics.pdf
File Size 107.62 KB
Manufacturer Samsung Electronics
Description 128M-bit SDRAM
K4S280832B page 2 K4S280832B page 3

K4S280832B Overview

The K4S280832B is 134,217,728 bits synchronous high data rate Dynamic RAM organized as 4 x 4,194,304 words by 8 bits, fabricated with SAMSUNG′s high performance CMOS technology. Synchronous design allows precise cycle control with the use of system clock I/O transactions are possible on every clock cycle. Range of operating frequencies, programmable burst length and programmable latencies allow the same device to be...

K4S280832B Key Features

  • JEDEC standard 3.3V power supply
  • LVTTL patible with multiplexed address
  • Four banks operation
  • MRS cycle with address key programs -. CAS latency (2 & 3) -. Burst length (1, 2, 4, 8 & Full page) -. Burst type (Seque
  • All inputs are sampled at the positive going edge of the system clock
  • Burst read single-bit write operation
  • DQM for masking
  • Auto & self refresh
  • 64ms refresh period (4K cycle)

K4S280832B Applications

  • Samsung Electronics reserves the right to change products or specification without notice

K4S280832A from other manufacturers

View K4S280832A datasheet index

Brand Logo Part Number Description Other Manufacturers
Samsung semiconductor Logo K4S280832A 128Mbit SDRAM 4M x 8Bit x 4 Banks Synchronous DRAM LVTTL Samsung semiconductor
Samsung semiconductor Logo K4S280832C 128Mbit SDRAM 4M x 8Bit x 4 Banks Synchronous DRAM LVTTL Samsung semiconductor
Samsung semiconductor Logo K4S280832E-TC75 128Mb E-die SDRAM Specification Samsung semiconductor
Samsung semiconductor Logo K4S280832E-TL75 128Mb E-die SDRAM Specification Samsung semiconductor
Samsung semiconductor Logo K4S280832F-TC75 128Mb F-die SDRAM Specification Samsung semiconductor
Samsung Electronics logo - Manufacturer

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