CIM10F600 Overview
Multi-layer type B:Mono-layer type (3) Dimension (4) Material Code (5) Nominal impedance (121:120Ω, 202:2000Ω ) (6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) (7) Packaging(C:paper tape, E:embossed tape) REMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PACKAGING Packaging Style Card Board Taping Quantity(pcs/reel) 4000 NOTICE :All specifications are subject to change...
CIM10F600 Key Features
- Perfect shape for automatic mounting, with no directionality
- Excellent solderability and high heat resistance for either flow or
- Monolithic inorganic material construction for high reliability
- Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs
- NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or