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K4T1G044QF - 1Gb F-die DDR2 SDRAM

General Description

5.

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7.

Key Features

  • 4 3. Package pinout/Mechanical Dimension & Addressing 5 3.1 x4 Package Pinout (Top view) : 60ball FBGA Package 5 3.2 x8 Package Pinout (Top view) : 60ball FBGA Package 6 3.3 x16 Package Pinout (Top view) : 84ball FBGA Package 7 3.4 FBGA Package Dimension (x4/x8) 8 3.5 FBGA Package Dimension (x16) 9 4. Input/Output Functional.

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Other Datasheets by Samsung Semiconductor

Part Number Description
K4T1G044QF-BCE6 1Gb F-die DDR2 SDRAM
K4T1G044QF-BCE7 1Gb F-die DDR2 SDRAM
K4T1G044QF-BCF7 1Gb F-die DDR2 SDRAM
K4T1G044QM 1Gb M-die DDR2 SDRAM Specification
K4T1G084QF 1Gb F-die DDR2 SDRAM

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Rev. 1.2, Jul. 2011 K4T1G044QF K4T1G084QF K4T1G164QF 1Gb F-die DDR2 SDRAM 60FBGA/84FBGA with Lead-Free & Halogen-Free (RoHS compliant) datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise.