MBRF2060CT Overview
Key Features
- 150°C TJ operation
- Center tap configuration
- Low forward voltage drop
- High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
- High frequency operation
- Guard ring for enhanced ruggedness and long term reliability
- Terminals: pure tin plated, solderable per MIL-STD-750, Method 2026
- This is a Pb
- All SMC parts are traceable to the wafer lot
