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SEMiX155GD12T4 - IGBT

Key Features

  • Solderless assembling solution with PressFIT signal pins and screw power terminals.
  • IGBT 4 Trench Gate Technology.
  • VCE(sat) with positive temperature coefficient.
  • Low inductance case.
  • Reliable mechanical design with injection moulded terminals and reliable internal connections.
  • UL recognized file no. E63532.
  • NTC temperature sensor inside Typical.

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The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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SEMiX155GD12T4 SEMiX® 5 Trench IGBT Modules Evaluation Sample SEMiX155GD12T4 Target Data Features • Solderless assembling solution with PressFIT signal pins and screw power terminals • IGBT 4 Trench Gate Technology • VCE(sat) with positive temperature coefficient • Low inductance case • Reliable mechanical design with injection moulded terminals and reliable internal connections • UL recognized file no.