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SKiM429GD17E4V5
SKiM® 93
Trench IGBT Modules
SKiM429GD17E4V5 Features*
• IGBT 4 Trench Gate Technology • Solderless sinter technology • VCE(sat) with positive temperature
coefficient • Low inductance case • Insulated by Al2O3 DBC (Direct Bonded
Copper) ceramic substrate • Pressure contact technology for
thermal contacts • Spring contact system to attach driver
PCB to the control terminals • High short circuit capability, self limiting
to 6 x IC • Integrated temperature sensor • Improved power cycle capability of
diodes due to AlCu-bond wires
Typical Applications
• Automotive inverter • High reliability AC inverter wind • High reliability AC inverter drives
Remarks
• Case temperature limited to Ts = 125°C max; Tc = Ts (for baseplateless modules)
• Recommended Top = -40 … +150°C
GD © by SEM
SKiM429GD17E4V5 Datasheet
