SKiM601TMLI12E4B Datasheet | Semikron Danfoss

Features - IGBT 4 Trench Gate Technology - Solder technology - VCE(sat) with positive temperature coefficient - Low inductance case - Insulated by Al2O3 DCB (Direct Copper Bonded) ceramic substrate - Pressure contact technology for thermal contacts - Spring contact system to attach driver PCB to the control terminals - High short circuit capability, self limiting to 6 x IC - Integrated temperature sensor Remarks- - Case temperature limited to Ts = 125°C max; Tc = Ts (for baseplateless modules) - Remended Top = -40 ...+150°C - IGBT1: outer IGBTs T1 & T4 - IGBT2: inner IGBTs T2 & T3 - Diode1: outer diodes D1 & D4 - Diode2: inner diodes D2 & D3 Absolute Maximum Ratings Symbol Conditions IGBT1 VCES IC ICnom ICRM VGES tpsc Tj IGBT2 VCES IC ICnom ICRM VGES tpsc Tj Diode1 VRRM IF IFnom IFRM IFSM Tj Diode2 VRRM IF IFnom IFRM IFSM Tj Module It(RMS) Tstg Visol Tj = 25 °C λpaste=0.8 W/(m K) Tj = 175 °C λpaste=2.5 W/(m K) Tj = 175 °C Ts = 25 °C Ts = 70 °C Ts = 25 °C Ts = 70 °C ICRM = 3 x ICnom VCC = 800 V, VGE ≤ 15 V, Tj = 150 °C, VCES ≤ 1200 V Tj = 25 °C λpaste=0.8 W/(m K) Tj = 175 °C λpaste=2.5 W/(m K) Tj = 175 °C Ts = 25 °C Ts = 70 °C Ts = 25 °C Ts = 70 °C ICRM = 3 x ICnom VCC = 360 V, VGE ≤ 15 V, Tj = 150 °C, VCES ≤ 650 V Tj = 25 °C λpaste=0.8 W/(m K) Tj = 175 °C λpaste=2.5 W/(m K) Tj = 175 °C Ts = 25 °C Ts = 70 °C Ts = 25 °C Ts = 70 °C IFRM = 2 x IFnom 10 ms, sin 180°, Tj = 25...