Datasheet4U Logo Datasheet4U.com

PC81715NSZ0F - Low Input Current Photocoupler

Download the PC81715NSZ0F datasheet PDF. This datasheet also covers the PC8171xNSZ0F variant, as both devices belong to the same low input current photocoupler family and are provided as variant models within a single manufacturer datasheet.

Description

PC8171xNSZ0F Series contains an IRED optically coupled to a phototransistor.

It is packaged in a 4pin DIP, available in SMT gullwing lead-form option.

Input-output isolation voltage(rms) is 5.0kV.

Features

  • 1. 4pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. Low input current type (IF=0.5mA) 4. High collector-emitter voltage(VCEO : 80V) 5. High noise immunity due to high common rejection voltage (CMR : MIN. 10kV/µs) 6. High isolation voltage between input and output (Viso(rms) : 5.0 kV) 7. Lead-free and RoHS directive compliant Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SH.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (PC8171xNSZ0F-Sharp.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription

Click to expand full text
PC8171xNSZ0F Series PC8171xNSZ0F Series DIP 4pin High CMR, Low Input Current Photocoupler ■ Description PC8171xNSZ0F Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4pin DIP, available in SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. Collector-emitter voltage is 80V, CTR is 100% to 600% at input current of 0.5mA and CMR is MIN. 10kV/µs. ■ Agency approvals/Compliance 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC8171) 2. Package resin : UL flammability grade (94V-0) ■ Applications 1. Programmable controllers 2. Facsimiles 3. Telephones ■ Features 1. 4pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. Low input current type (IF=0.5mA) 4.
Published: |