BUP200
BUP200 is IGBT manufactured by Siemens Semiconductor Group.
BUP 200
IGBT Preliminary data
- Low forward voltage drop
- High switching speed
- Low tail current
- Latch-up free
- Avalanche rated Pin 1 G Type BUP 200 Maximum Ratings Parameter Collector-emitter voltage Collector-gate voltage Symbol Values 1200 1200 Unit V Pin 2 C Ordering Code Q67078-A4400-A2 Pin 3 E
Package TO-220 AB
1200V 3.6A
VCE VCGR VGE IC
RGE = 20 kΩ
Gate-emitter voltage DC collector current
± 20 A 3.6 2.4
TC = 25 °C TC = 90 °C
Pulsed collector current, tp = 1 ms
ICpuls
7.2 4.8
TC = 25 °C TC = 90 °C
Avalanche energy, single pulse
3.5 m J
IC = 1.5 A, VCC = 50 V, RGE = 25 Ω L = 3.3 m H, Tj = 25 °C
Power dissipation
Ptot
W -55 ... + 150 -55 ... + 150 °C
TC = 25 °C
Chip or operating temperature Storage temperature
Tj Tstg
Semiconductor Group
Dec-06-1995
BUP 200
Maximum Ratings Parameter DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Thermal Resistance IGBT thermal resistance, chip case Symbol Values E 55 / 150 / 56 Unit
- Rth JC
≤ 3.1
K/W
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol min. Static Characteristics Gate threshold voltage Values typ. max....