TLP759IGM Datasheet | Toshiba

TOSHIBA Photocoupler IRED + Photo IC TLP759(IGM) Transistor Inverters Air Conditioners Line Receiver Intelligent Power Modules (IPMs) Interfaces TLP759(IGM) Unit: mm The TOSHIBA TLP759(IGM) consists of a high- output infrared emitting diode optically coupled to a high-speed photodiode with a transistor amplifier and is housed in an 8- pin DIP. The TLP759(IGM) has no internal base connection. The Faraday shield in the photodetector chip provides an effective mon-mode noise transient immunity. The TLP759(IGM) guarantees minimum and maximum propagation delay, relative time difference between the rise and fall time, and mon-mode transient immunity. Therefore, the TLP759(IGM) is suitable for an isolation interface between an intelligent power module (IPM) and a control IC in motor control applications. - Isolation voltage: 5000Vrms (min) - mon-mode transient immunity: ±10 k V / μs (min) @VCM = 1500 Vp- p - Switching Time: tp HL, tp LH = 0.1 μs (min), = 0.8 μs (max) @IF = 10 m A, VCC = 15 V, RL = 20 kΩ, Ta = 25°C - Switching time dispersion: 0.7 μs (max) (|tp LH-tp HL|) - TTL patible - UL-recognized: UL 1577, File No.E67349 - c UL-recognized: CSA ponent Acceptance Service No.5A File No.E67349 - VDE-approved: EN 60747-5-5 (Note 1) TOSHIBA 11- 10C4S Weight: 0.54 g (typ.) Pin Configuration (top view) 1 2 3 4 SHIELD 8 1: NC 2: Anode 3: Cathode 7 4: NC 5: Emitter (GND) 6 6: Collector (Output) 7: NC 5 8: VCC Note 1 : When a VDE-approved type is needed, please designate the Option (D4). - Construction mechanical rating 7.62-mm pitch standard type Creepage Distance 7.0 mm...