TQHBT3 Overview
TriQuint’s new TQHBT3 process is a highly reliable InGaP HBT process with three levels of interconnecting metal and state-of-the-art device performance. Thick metal interconnects and high quality passives promote integration. The thick metal interconnects, which promote enhanced thermal management, and high density capacitors keep die sizes small.
TQHBT3 Key Features
- MIM Metal 0 Isolation Implant
- 2um Dielectric
- Sub Collector Buffer & Substrate
- TQHBT3 Process Cross-Section
- General Description