TQHBT3 Datasheet InGaP HBT Foundry Service

Manufacturer: TriQuint Semiconductor

Overview: Production Process InGaP HBT Foundry Service.

TQHBT3 ingap hbt foundry service by TriQuint Semiconductor - Datasheet Preview

Datasheet Details

Part number	TQHBT3
Manufacturer	TriQuint Semiconductor
File Size	148.94 KB
Description	InGaP HBT Foundry Service
Download	TQHBT3 Download (PDF)

General Description

TriQuint’s new TQHBT3 process is a highly reliable InGaP HBT process with three levels of interconnecting metal and state-of-the-art device performance.

Thick metal interconnects and high quality passives promote integration.

The thick metal interconnects, which promote enhanced thermal management, and high density capacitors keep die sizes small.

Key Features

Metal 2 - 4um TQHBT3.
MIM Metal 0 Isolation Implant Dielectric Metal 1 - 2um Dielectric E Emitter Metal 1 - 2um www. DataSheet4U. com B C B C NiCr Base Collector.
Sub Collector Buffer & Substrate.
TQHBT3 Process Cross-Section.
General.

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