Datasheet Summary
AlGaAs Solder Bump Flip-Chip PIN Diode
Features
- Low Series Resistance, 4 Ω
- Ultra Low Capacitance, 25 fF
- High Switching Cutoff Frequency, 40 GHz
- 2 Nanosecond Switching Speed
- Can be Driven by Buffered TTL
- Silicon Nitride Passivation
- Polyimide Scratch Protection
- Solderable Bump Die Attach Description
MA4AGSBP907 Rev 2.0
Mounting Side with Solder Bumps
M/A-'s MA4AGSBP907 is an Aluminum Gallium Arsenide Flip-Chip PIN diode with solder bumps.These devices are fabricated on OMCVD epitaxial wafers using a process designed for high device uniformity and extremely low parasitics. The diodes exhibit an extremely low RC Product, ( 0.1 ps ) and 2 nS switching characteristics. The...