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MA4AGSBP907 - AlGaAs Solder Bump Flip-Chip PIN Diode

General Description

M/A-COM's MA4AGSBP907 is an Aluminum Gallium Arsenide Flip-Chip PIN diode with solder bumps.These devices are fabricated on OMCVD epitaxial wafers using a process designed for high device uniformity and extremely low parasitics.

Key Features

  • Low Series Resistance, 4 Ω.
  • Ultra Low Capacitance, 25 fF.
  • High Switching Cutoff Frequency, 40 GHz.
  • 2 Nanosecond Switching Speed.
  • Can be Driven by Buffered TTL.
  • Silicon Nitride Passivation.
  • Polyimide Scratch Protection.
  • Solderable Bump Die Attach.

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AlGaAs Solder Bump Flip-Chip PIN Diode Features • Low Series Resistance, 4 Ω • Ultra Low Capacitance, 25 fF • High Switching Cutoff Frequency, 40 GHz • 2 Nanosecond Switching Speed • Can be Driven by Buffered TTL • Silicon Nitride Passivation • Polyimide Scratch Protection • Solderable Bump Die Attach Description MA4AGSBP907 Rev 2.0 Mounting Side with Solder Bumps M/A-COM's MA4AGSBP907 is an Aluminum Gallium Arsenide Flip-Chip PIN diode with solder bumps.These devices are fabricated on OMCVD epitaxial wafers using a process designed for high device uniformity and extremely low parasitics. The diodes exhibit an extremely low RC Product, ( 0.1 ps ) and 2 nS switching characteristics. The useable frequency range is 100 MHz to 40 GHz.