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MA4AGSBP907 Datasheet Algaas Solder Bump Flip-chip Pin Diode

Manufacturer: Tyco Electronics (now TE Connectivity)

Overview: AlGaAs Solder Bump Flip-Chip PIN Diode.

General Description

MA4AGSBP907 Rev 2.0 Mounting Side with Solder Bumps M/A-'s MA4AGSBP907 is an Aluminum Gallium Arsenide Flip-Chip PIN diode with solder bumps.These devices are fabricated on OMCVD epitaxial wafers using a process designed for high device uniformity and extremely low parasitics.

The diodes exhibit an extremely low RC Product, ( 0.1 ps ) and 2 nS switching characteristics.

The useable frequency range is 100 MHz to 40 GHz.

Key Features

  • Low Series Resistance, 4 Ω.
  • Ultra Low Capacitance, 25 fF.
  • High Switching Cutoff Frequency, 40 GHz.
  • 2 Nanosecond Switching Speed.
  • Can be Driven by Buffered TTL.
  • Silicon Nitride Passivation.
  • Polyimide Scratch Protection.
  • Solderable Bump Die Attach.

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