| Part number | MADS-001317-1320AG |
|---|---|
| Manufacturer | Tyco Electronics (now TE Connectivity) |
| File Size | 141.49 KB |
| Description | GaAs Solder Bump Flip Chip Schottky Diode |
| Datasheet | MADS-001317-1320AG_TycoElectronics.pdf |
|
|
M/A-’s MADS-001317-1320AG is a Gallium Arsenide Flip-Chip Schottky diode with solder bumps. These devices are fabricated on OMCVD epitaxial wafers using a process designed for high device uniformity and extremely low parasitics. This device can be used up to 80 GHz.
See all Tyco Electronics (now TE Connectivity) datasheets
| Part Number | Description |
|---|---|
| MADS-002545-1307M | SURMOUNTTM Medium Barrier Silicon Schottky Diodes |
| MADCSM0001 | Dual-Band/Triple-Mode Downconverter |
| MADCSM0011 | Dual Mode Cellular Downconverter |
| MADCSM0012 | PCS LNA / Downconverter |
| MADP-008120-12790T | Surface Mount Plastic PIN Diodes |
| MADP-042005 | SURMOUNT TM 5 um PIN Diodes |
| MADP-064908-131000 | Surface Mount Monolithic Integrated PIN Diode |
| MADR-007097-000100 | SPDT PIN Diode Driver |
| MADR-007098-000100 | Linear Driver |
| MADR-007131-000100 | Dual Linear Driver |
