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MADS-001317-1320AG - GaAs Solder Bump Flip Chip Schottky Diode

General Description

M/A-COM’s MADS-001317-1320AG is a Gallium Arsenide Flip-Chip Schottky diode with solder bumps.

These devices are fabricated on OMCVD epitaxial wafers using a process designed for high device uniformity and extremely low parasitics.

This device can be used up to 80 GHz.

Key Features

  • Low Series Resistance, 4 Ω.
  • Low Capacitance, 45 fF.
  • High Cutoff Frequency.
  • Silicon Nitride Passivation.
  • Polyimide Scratch Protection.
  • Solderable Bump Die Attach.

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MADS-001317-1320AG GaAs Solder Bump Flip Chip Schottky Diode Features • Low Series Resistance, 4 Ω • Low Capacitance, 45 fF • High Cutoff Frequency • Silicon Nitride Passivation • Polyimide Scratch Protection • Solderable Bump Die Attach Description M/A-COM’s MADS-001317-1320AG is a Gallium Arsenide Flip-Chip Schottky diode with solder bumps. These devices are fabricated on OMCVD epitaxial wafers using a process designed for high device uniformity and extremely low parasitics. This device can be used up to 80 GHz. This diode is fully passivated with silicon nitride and has an additional layer of a polymer for scratch protection. The protective coatings prevent damage to the junction during handling and circuit attachment.