MADS-002545-1307M Key Features
- Ultra Low Parasitic Capitance and Inductance
- Surface Mountable in Microwave Circuits , No Wirebonds Required
- Rugged HMIC Construction with Polyimide Scratch Protection
- Reliable, Multilayer Metalization with a Diffusion
- Barrier, 100% Stabilization Bake (300 °C, 16 hours)
- Lower Susceptibility to ESD Damage