FCSP230LTR Description
Vishay's FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The four bump 1.5 x 1.5 mm devices can deliver up to 1.5 A and occupy only 2.3 mm2 of board space. The anode and cathode connections are made through solder bump pads on one side of the silicon enabling designers to strategically place the diodes on the PCB.
FCSP230LTR Key Features
- Ultra low VF per footprint area
- Low leakage
- Low thermal resistance
- One-fifth footprint of SMA
- Super low profile (0.6 mm)
- Available tested on tape and reel
FCSP230LTR Applications
- Reverse polarity protection