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FCSP230LTR - Chip Scale Package Schottky Barrier Rectifier

Description

Vishay's FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry.

The four bump 1.5 x 1.5 mm devices can deliver up to 1.5 A and occupy only 2.3 mm2 of board space.

Features

  • Ultra low VF per footprint area.
  • Low leakage.
  • Low thermal resistance.
  • One-fifth footprint of SMA.
  • Super low profile (0.6 mm).
  • Available tested on tape and reel RoHS.

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Datasheet preview – FCSP230LTR

Datasheet Details

Part number FCSP230LTR
Manufacturer Vishay Siliconix
File Size 134.75 KB
Description Chip Scale Package Schottky Barrier Rectifier
Datasheet download datasheet FCSP230LTR Datasheet
Additional preview pages of the FCSP230LTR datasheet.

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Full PDF Text Transcription

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FCSP230LTR Vishay High Power Products FlipKY®, 1.5 A Chip Scale Package Schottky Barrier Rectifier FEATURES • Ultra low VF per footprint area • Low leakage • Low thermal resistance • One-fifth footprint of SMA • Super low profile (0.6 mm) • Available tested on tape and reel RoHS COMPLIANT APPLICATIONS • Reverse polarity protection FlipKY® • Current steering • Freewheeling • Flyback • Oring DESCRIPTION Vishay's FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The four bump 1.5 x 1.5 mm devices can deliver up to 1.5 A and occupy only 2.3 mm2 of board space.
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