Datasheet4U Logo Datasheet4U.com

BU2508-M3 - Bridge Rectifiers

Download the BU2508-M3 datasheet PDF. This datasheet also covers the BU2506-M3 variant, as both devices belong to the same bridge rectifiers family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • UL recognition file number E309391 (QQQX2) UL 1557 (see.
  • ).
  • Thin single in-line package.
  • Available for BU-5S lead forming option (part number with “5S” suffix, e. g. BU25065S).
  • Superior thermal conductivity.
  • Solder dip 275 °C max. 10 s, per JESD 22-B106.
  • Material categorization: For definitions of compliance please see www. vishay. com/doc?99912 +~~ -.
  • Tested to UL standard for safety electrically isolated semiconductor devices. UL 15.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (BU2506-M3-Vishay.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number BU2508-M3
Manufacturer Vishay
File Size 106.81 KB
Description Bridge Rectifiers
Datasheet download datasheet BU2508-M3 Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
BU2508A Silicon Diffused Power Transistor NXP
BU2508A SILICON POWER TRANSISTOR SavantIC
BU2508A NPN Transistor INCHANGE
BU2508AF Silicon Diffused Power Transistor NXP
BU2508AF SILICON POWER TRANSISTOR SavantIC

Other Datasheets by Vishay

Part Number Description
BU2508-E3 Bridge Rectifiers
BU2508 Bridge Rectifiers
BU2506 Bridge Rectifiers
BU2506-E3 Bridge Rectifiers
BU2506-M3 Bridge Rectifiers

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.vishay.com BU2506-M3, BU2508-M3, BU2510-M3 Vishay General Semiconductor Enhanced isoCink+TM Bridge Rectifiers isoCink+™ + ~~ - Case Style BU - ~~+ FEATURES • UL recognition file number E309391 (QQQX2) UL 1557 (see *) • Thin single in-line package • Available for BU-5S lead forming option (part number with “5S” suffix, e.g. BU25065S) • Superior thermal conductivity • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 +~~ - * Tested to UL standard for safety electrically isolated semiconductor devices. UL 1557 4th edition. Dielectric tested to maximum case, storage and junction temperature to 150 °C to withstand 1500 V. Epoxy meets UL 94 V-0 flammability rating.