BU2508 Description
BU2506, BU2508, BU2510 Vishay General Semiconductor Enhanced isoCink+™ Bridge Rectifiers + ~~ isoCink+™ Case Style BU - ~~+ +~~ - LINKS TO ADDITIONAL RESOURCES 3D 3D 3D Models PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM IR VF at IF = 12.5 A TJ max. Package 25 A 600 V, 800 V, 1000 V 300 A 5 μA 0.87 V 150 °C BU Circuit configurations In-line.
BU2508 Key Features
- UL recognition file number E312394
- Thin single in-line package
- Glass passivated chip junction
- Superior thermal conductivity
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- Material categorization: for definitions of pliance please see .vishay./doc?99912