BU2508 Overview
Key Specifications
Package: SIP
Mount Type: Through Hole
Pins: 4
Height: 18.8 mm
Key Features
- UL recognition file number E312394
- Thin single in-line package
- Glass passivated chip junction
- Superior thermal conductivity Available
- Solder dip 275 °C max. 10 s, per JESD 22-B106
