IRF624S Overview
Description
Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D2PAK (TO-263) is a surface-mount power package capable of accommodating die sizes up to HEX-4.
Key Features
- Surface-mount
- Available in tape and reel
- Dynamic dv/dt rating
- Repetitive avalanche rated Available
- Fast switching
- Ease of paralleling Available
- Simple drive requirements
