IRF624S
Overview
Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D2PAK (TO-263) is a surface-mount power package capable of accommodating die sizes up to HEX-4.
- Surface-mount
- Available in tape and reel
- Dynamic dv/dt rating
- Repetitive avalanche rated Available
- Fast switching
- Ease of paralleling Available
- Simple drive requirements
- Material categorization: for definitions of compliance please see Note
- This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details
