MUH1PB
Key Features
- eSMP TM Series
- Very low profile - typical height of 0.65 mm
- Ideal for automated placement
- Oxide planar chip junction
- Low forward voltage drop, low leakage current
- Ultrafast recovery times for high frequency
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- Solder dip 265 °C max. 10 s, per JESD 22-A111
- pliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition MECHANICAL DATA Case: MicroSMP Molding pound meets UL 94 V-0 flammability rating
