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New Product
MUH1PB thru MUH1PD
Vishay General Semiconductor
Surface Mount Ultrafast Rectifiers
FEATURES
eSMP TM Series
• Very low profile - typical height of 0.65 mm • Ideal for automated placement • Oxide planar chip junction • Low forward voltage drop, low leakage current • Ultrafast recovery times for high frequency • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
Top View
Bottom View
MicroSMP
PRIMARY CHARACTERISTICS
IF(AV) VRRM IFSM trr VF at IF = 1.0 A IR TJ max. 1.0 A 100 V, 150 V, 200 V 10 A 25 ns 0.82 V 1 µA 175 °C
• Solder dip 265 °C max.
MUH1PD Datasheet
