Vishay MUH1PC
Surface Mount Ultrafast Rectifiers
FEATURES
eSMP TM Series● Very low profile - typical height of 0.65 mm
● Ideal for automated placement
● Oxide planar chip junction
● Low forward voltage drop, low leakage current
● Ultrafast recovery times for high frequency
● Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C Top View Bottom View MicroSMP PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM trr VF at IF = 1.0 A IR TJ max. 1.0 A 100 V, 150 V, 200 V 10 A 25 ns 0.82 V 1 µA 175 °C
● Solder dip 265 °C max. 10 s, per JESD 22-A111
● Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC
● Halogen-free according to IEC 61249-2-21 definition
MECHANICAL DATA
Case: MicroSMP Molding compound meets UL 94 V-0 flammability ratingTYPICAL APPLICATIONS
For use in secondary rectification and freewheeling for ultrafast switching speeds ac-to-ac and dc-to-dc converters for commercial applications. Base P/N-M3 - halogen-free and RoHS compliant, commercial grade Terminals: Matte tin plated leads, solderable per J-STD-002...