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MUH1PC - (MUH1Px) Surface Mount Ultrafast Rectifiers

Download the MUH1PC datasheet PDF. This datasheet also covers the MUH1PD variant, as both devices belong to the same (muh1px) surface mount ultrafast rectifiers family and are provided as variant models within a single manufacturer datasheet.

Features

  • eSMP TM Series.
  • Very low profile - typical height of 0.65 mm.
  • Ideal for automated placement.
  • Oxide planar chip junction.
  • Low forward voltage drop, low leakage current.
  • Ultrafast recovery times for high frequency.
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C Top View Bottom View MicroSMP.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MUH1PD_Vishay.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number MUH1PC
Manufacturer Vishay
File Size 118.76 KB
Description (MUH1Px) Surface Mount Ultrafast Rectifiers
Datasheet download datasheet MUH1PC Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer

Other Datasheets by Vishay

Part Number Description
MUH1PB (MUH1Px) Surface Mount Ultrafast Rectifiers
MUH1PD (MUH1Px) Surface Mount Ultrafast Rectifiers

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
New Product MUH1PB thru MUH1PD Vishay General Semiconductor Surface Mount Ultrafast Rectifiers FEATURES eSMP TM Series • Very low profile - typical height of 0.65 mm • Ideal for automated placement • Oxide planar chip junction • Low forward voltage drop, low leakage current • Ultrafast recovery times for high frequency • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C Top View Bottom View MicroSMP PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM trr VF at IF = 1.0 A IR TJ max. 1.0 A 100 V, 150 V, 200 V 10 A 25 ns 0.82 V 1 µA 175 °C • Solder dip 265 °C max.
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