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VS-40MT160P-P - MTP PressFit Power Module

Description

The new MTP module is easy to use thanks to solder less method for contacting PressFit pins to the PCB.

The low profile package has been specifically conceived to maximize space saving and optimize the electrical layout of the application specific power supplies.

Features

  • Low VF.
  • Low profile package.
  • Direct mounting to heatsink.
  • PressFit pins technology.
  • Low junction to case thermal resistance.
  • 3500 VRMS insulation voltage.
  • UL approved file E78996.
  • Designed and qualified for industrial level.
  • Material categorization: For definitions of compliance please see www. vishay. com/doc?99912.

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Full PDF Text Transcription

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VS-40MT160P-P, VS-70MT160P-P, VS-100MT160P-P www.vishay.com Vishay Semiconductors MTP PressFit Power Module Three Phase Bridge, 45 A to 100 A MTP PressFit PRODUCT SUMMARY IO VRRM Package Circuit 45 A to 100 A 1600 V MTP PressFit Three phase bridge FEATURES • Low VF • Low profile package • Direct mounting to heatsink • PressFit pins technology • Low junction to case thermal resistance • 3500 VRMS insulation voltage • UL approved file E78996 • Designed and qualified for industrial level • Material categorization: For definitions of compliance please see www.vishay.
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