2SA812SLT1
Overview
- Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. FE
- ALToUwRpErofile surface mounted application in order to optimize board space. ƽ
- HLigohwVpooltwageer:loVsCsEO, h=. ƽ
- , low forward voltage drop. SOD-123H
- 146(3.7) 0.130(3.3) ƽ
- NHPiNghcosmurpgleemceanpta: 2bSiliCty1.623 ƽ
- WGeuaderdcrlainrge ftohratotvheervmoalttaegriealporof pteroctdiuocnt. compliance with RoHS requirements.
- PUbl-tFrareheigpha-cskpaegede
- RSoiHlicSopnreopdiutactxifaolrpplaacnkainr gchciopd, emesutafflixsi”liGco” n junction.
- HLaeloagde-fnrefreepeaprrtsodmuecet tfoernpvaircokninmgecnotadlesstaunffdixa“rHds” of
