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SE3401 - SOT-23 Plastic-Encapsulate MOSFETS

Key Features

  • Package outline.
  • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
  • Low profile surface mounted.

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Datasheet Details

Part number SE3401
Manufacturer WILLAS
File Size 559.41 KB
Description SOT-23 Plastic-Encapsulate MOSFETS
Datasheet download datasheet SE3401 Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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WILLAS SO1T.0A-2S3URPFAlCaEsMtiOcU-NETnSCcHaOpTTsKuYlBaAtReRIMERORESCFTIEFIETRSS -20V- 200V SOD-123+ PACKAGE FM120-M SE3401 THRU FM1200-M Pb Free Produ Features Package outline • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to SOD-123H optimize board space. • Low power loss, high efficiency. • High current capability, low forward voltage drop. 0.146(3.7) 0.130(3.3) • High surge capability. P-Channe• lGEunarhdarinncgefomr eovnetrvMooltadgeeFprieotldecEtioffne. ct Transistor • Ultra high-speed switching. SOT-23 • Silicon epitaxial planar chip, metal silicon junction.