WMSC008H12B1P Description
WeEnPACK-B1 module with WeEn 1200V Gen2 SiC MOSFET and PressFit pin type. Intergrated with NTC temperature sensor.
WMSC008H12B1P Key Features
- Half bridge topology
- PressFit pins technology
- Low RDSon
- Low Switching Losses
- Low Qg and Crss
- Low Inductive Design