Datasheet Summary
Zener Diode Chips (Dual Pad) for ESD Bidrectional Protection
1. Feature:
1-1 This specification applies to N/P/N silicon zener double diodes chips, Device NO. WT-Z224V-AU4
2. Structure:
2-1. Planar type : N/P/N Diode. 2-2. Electrodes : Top side : Gold pad. Back side : Gold Layer.
3. Size:
4. Electrical Characteristics (TA=25˚C)
Parameter Symbol Idf Leakage Current Idr
3-1. Chip size : 24 mils x 24 mils (609.6 μm x 609.6 μm). 3-2. Chip thickness :7.87 ± 1.0 mils (200 ± 2.54 μm). 3-3. Bonding pad : 19.3 mils x 19.3 mils (490 μm x 490 μm) . 3-4. Pattern drawing : Refer to the attached drawing.
- Including scribing line. The chip size is about 23mil(585μm) after dicing.
Condition...