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CAB525F12XM3 5 1200 V, 2.6 mΩ, Silicon Carbide, Half-Bridge Module
D
Technical Features
• High Power Density Footprint • High Junction Temperature (175 °C) Operation • Low-Inductance (6.7 nH) Design • Implements Wolfspeed’s Third Generation SiC MOSFET
Technology
• Silicon Nitride Insulator and Copper Baseplate
• Advanced Direct Cooling Baseplate
C
VDS
1200 V
4 IDS
3
525
A2 RMS
1
V+ V+
G1 K1
Mid
NTC1
G2 K2
-t°
NTC2 V-
Typical Applications • Motor and Motion Control • Vehicle Fast Chargers • Uninterruptable Power Supplies • Smart-Grid / Grid-Tied Distributed Generation • Traction Drives • E-mobility
System Benefits
3 8,9
• Terminal layout allows for direct bus bar connec-
tioBn without bends or low-iductance design.