ZXMN3B01F
ZXMN3B01F is N-Channel MOSFET manufactured by Zetex Semiconductors.
DESCRIPTION
This new generation of Trench MOSFETs from Zetex utilizes a unique structure that bines the benefits of low on-resistance with fast switching speed. This makes them ideal for high efficiency, low voltage, power management applications.
FEATURES
- Low on-resistance
- Fast switching speed
- Low threshold
- Low gate drive
- SOT23 package
SOT23
APPLICATIONS
- DC-DC Converters
- Power Management functions
- Disconnect switches
- Motor control
ORDERING INFORMATION
DEVICE ZXMN3B01FTA ZXMN3B01FTC REEL SIZE 7” 13” TAPE WIDTH 8mm 8mm QUANTITY PER REEL 3000 units 10000 units
PINOUT
DEVICE MARKING
- 3B1
TOP VIEW
ISSUE 1
- DECEMBER 2005 1
ABSOLUTE MAXIMUM RATINGS
PARAMETER Drain-Source Voltage Gate-Source Voltage Continuous Drain Current @ V GS =4.5V; T A =25°C (b) @ V GS =4.5V; T A =70°C (b) @ V GS =4.5V; T A =25°C (a) Pulsed Drain Current
(c)
SYMBOL V DSS V GS ID
LIMIT 30 Ϯ12 2.0 1.6 1.7
UNIT V V A A A A A A m W m W/°C m W m W/°C °C
I DM IS I SM PD PD T j , T stg
9.4 1.3 9.4 625 5 806 6.4 -55 to +150
Continuous Source Current (Body Diode) (b) Pulsed Source Current (Body Diode) (c) Power Dissipation at T A =25°C (a) Linear Derating Factor Power Dissipation at T A =25°C Linear Derating Factor Operating and Storage Temperature Range
(b)
THERMAL RESISTANCE
PARAMETER Junction to Ambient
(a)
SYMBOL R ⍜ JA R ⍜ JA
VALUE 200 155
UNIT °C/W °C/W
Junction to Ambient (b)
NOTES (a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) For a device surface mounted on FR4 PCB measured at t Յ 5 sec. (c) Repetitive...
