Texas Instruments 74ACT11138
The 74ACT11138 is characterized for operation from – 40°C to 85°C.| Part No. | 74ACT11138 |
|---|---|
| Datasheet | 74ACT11138 Download |
| Manufacturer |  Texas Instruments |
| Description | 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS |
| Buy | Stock & Price |
54ACT11138, 74ACT11138 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS SCAS050A – D3266, JANUARY 1989 – REVISED APRIL 1993
● Designed Specifically for High-Speed 54ACT11138 . . . J PACKAGE Memory Decoders and Data Transmission 74ACT11138 . . . D, N, OR PW PACKAGE Systems (TOP VIEW)
● Incorporates Three Enable Inputs to Simplify Cascading and/or Data Reception
● Flow-Through Architecture Optimizes PCB Layout
● Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise t● EPIC (Enhanced-Performance Implanted Y1 Y2 Y3 GND Y4 Y5 Y6 1 2 3 4 5 6 7 16 Y0 15 A 14 B 13 C 12 VCC 11 G1 10 G2A CMOS) 1-mm Process Y7 8 9 G2B
● 650-mA Typical Latch-Up Immunity at 125°C
● Package Options Include Plastic Small-Outline Packages, Plastic Thin 54ACT11138 . . . FK PACKAGE (TOP VIEW) B C NC VCC G1 Shrink Small-Outline Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs 3 2 1 20 19 A4 18 G2A description Y0 5 17 G2B The ′ACT11138 circuit is designed to be used in high-performance memory-decoding or datarouting applications requiring very short NC 6 16 NC Y1 7 15 Y7 Y2 8 14 9 10 11 12 13 Y6 propagation delay times.
● Designed Specifically for High-Speed 54ACT11138 . . . J PACKAGE Memory Decoders and Data Transmission 74ACT11138 . . . D, N, OR PW PACKAGE Systems (TOP VIEW)
● Incorporates Three Enable Inputs to Simplify Cascading and/or Data Reception
● Flow-Through Architecture Optimizes PCB Layout
● Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise t● EPIC (Enhanced-Performance Implanted Y1 Y2 Y3 GND Y4 Y5 Y6 1 2 3 4 5 6 7 16 Y0 15 A 14 B 13 C 12 VCC 11 G1 10 G2A CMOS) 1-mm Process Y7 8 9 G2B
● 650-mA Typical Latch-Up Immunity at 125°C
● Package Options Include Plastic Small-Outline Packages, Plastic Thin 54ACT11138 . . . FK PACKAGE (TOP VIEW) B C NC VCC G1 Shrink Small-Outline Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs 3 2 1 20 19 A4 18 G2A description Y0 5 17 G2B The ′ACT11138 circuit is designed to be used in high-performance memory-decoding or datarouting applications requiring very short NC 6 16 NC Y1 7 15 Y7 Y2 8 14 9 10 11 12 13 Y6 propagation delay times.
