CSD17552Q3A Description
This 30 V, 5.5 mΩ, 3.3 mm × 3.3 mm SON NexFET™ power MOSFET is designed to minimize losses in power conversion applications. (0.071 mm thick) Cu pad on a 0.06 inch (1.52 mm) thick FR4 PCB. CSD17552Q3A SLPS387B SEPTEMBER 2012 REVISED JANUARY 2016 .ti.
CSD17552Q3A Key Features
- 1 Ultra-Low Qg and Qgd
- Low Thermal Resistance
- Avalanche Rated
- Pb Free
- RoHS pliant
- Halogen Free
- SON 3.3 mm × 3.3 mm Plastic Package
CSD17552Q3A Applications
- Point-of-Load Synchronous Buck in Networking, Tele, and puting Systems
- Optimized for Control FET Applications