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TDA4AP-Q1 Description

TDA4VH-Q1, TDA4AH-Q1, TDA4VP-Q1, TDA4AP-Q1 SPRSP79B FEBRUARY 2023 REVISED DECEMBER 2023 TDA4VH-Q1, TDA4AH-Q1, TDA4VP-Q1, TDA4AP-Q1 Jacinto™ Processors.

TDA4AP-Q1 Key Features

  • Up to Four C7x floating point, vector DSP, up to 1.0 GHz, 320 GFLOPS, 1024 GOPS
  • Up to Four Deep-learning matrix multiply accelerator (MMAv2), up to 32 TOPS (8b) at 1.0 GHz
  • Two Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators
  • Depth and Motion Processing Accelerators (DMPAC)
  • Eight Arm® Cortex®-A72 microprocessor subsystem at up to 2.0 GHz
  • 2MB shared L2 cache per quad-core Cortex®A72 cluster
  • 32KB L1 DCache and 48KB L1 ICache per Cortex®-A72 core
  • Eight Arm® Cortex®-R5F MCUs at up to 1.0 GHz
  • 16K I-Cache, 16K D-Cache, 64K L2 TCM
  • Two Arm® Cortex®-R5F MCUs in isolated MCU

TDA4AP-Q1 Applications

  • Documentation available to aid ISO 26262
  • Systematic capability up to ASIL-D/SIL-3 targeted
  • Hardware integrity up to ASIL-D/SIL-3 targeted for MCU Domain
  • Hardware integrity up to ASIL-B/SIL-2 targeted for Main Domain
  • Hardware integrity up to ASIL-D/SIL-3 targeted for Extended MCU (EMCU) portion of the Main Domain