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BC847BQC-Q - 100mA NPN general-purpose transistor

Download the BC847BQC-Q datasheet PDF. This datasheet also covers the BC847AQC-Q variant, as both devices belong to the same 100ma npn general-purpose transistor family and are provided as variant models within a single manufacturer datasheet.

General Description

NPN general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless SurfaceMounted Device (SMD) plastic package with side-wettable flanks.

Table 1.

Key Features

  • High power dissipation capability.
  • Suitable for Automatic Optical Inspection (AOI) of solder joint.
  • Smaller footprint compared to conventional leaded SMD packages.
  • Low package height of 0.5 mm.
  • Qualified according to AEC-Q101 and recommended for use in automotive.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (BC847AQC-Q-nexperia.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number BC847BQC-Q
Manufacturer Nexperia
File Size 255.58 KB
Description 100mA NPN general-purpose transistor
Datasheet download datasheet BC847BQC-Q Datasheet

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Other Datasheets by Nexperia

Part Number Description
BC847BQA 100mA NPN general-purpose transistors
BC847BQB 100mA NPN general-purpose transistor
BC847B 100mA NPN transistors
BC847B-Q 100mA NPN general-purpose transistors
BC847BM 100mA NPN transistor

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
BC847xQC-Q series 45 V, 100 mA NPN general-purpose transistor Rev. 2 — 21 May 2021 Product data sheet 1. General description NPN general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless SurfaceMounted Device (SMD) plastic package with side-wettable flanks. Table 1. Product overview Type number BC847AQC-Q BC847BQC-Q BC847CQC-Q Package Nexperia SOT8009 JEDEC MO-340CA PNP complement: BC857AQC-Q BC857BQC-Q BC857CQC-Q 2. Features and benefits • High power dissipation capability • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • Qualified according to AEC-Q101 and recommended for use in automotive applications 3.