| Part Number | BYD17G Datasheet |
|---|---|
| Manufacturer | NXP Semiconductors |
| Overview |
Cavity free cylindrical glass package through Implotecâ„¢(1) technology. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
(1) Implotec is .
* Glass passivated * High maximum operating temperature * Low leakage current * Excellent stability * Guaranteed avalanche energy absorption capability * Shipped in 8 mm embossed tape * Smallest surface mount rectifier outline. DESCRIPTION Cavity free cylindrical glass package through Implotecâ„¢(1) t. |