1354 Datasheet | Specifications & PDF Download

A1354 High Precision 2-Wire Linear Hall Effect Sensor IC with Pulse Width Modulated Output Features and Benefits ▪ Designed for automotive, battery-p

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CC1354R10 SWRS266B – DECEMBER 2022 – REVISED APRIL 2024 CC1354R10 SimpleLink™ High-Performance Multiband Wireless MCU 1 Features Wireless microcontro

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LT1354 12MHz, 400V/µs Op Amp FEATURES s s s s s s s s s s s s s s s DESCRIPTION The LT ®1354 is a low power, high speed, high slew rate operational a

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Photo IC for optical link L11354-01 S11355-03 P11379-04AT Transmitter Receiver photo IC photo IC L11354-01 S11355-03 Transmitter/ receiver photo

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Datasheet R8C/35C Group RENESAS MCU R01DS0006EJ0100 Rev 1.00 Aug. 24, 2010 1. Overview 1.1 Features The R8C/35C Group of single-chip MCUs incorpor

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CY7C1354B CY7C1356B 9-Mb (256K x 36/512K x 18) Pipelined SRAM with NoBL™ Architecture Features • Pin-compatible and functionally equivalent to ZBT •

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RoHS Power Choke High Current Inches (mm) PCHC1354S Dimensions: Allied Part Number Inductance (µ h) Tolerance (%) Test Freq. KHz,1v DCR (Ω) Max

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CY7C1354BV25 CY7C1356BV25 256K x 36/512K x 18 Pipelined SRAM with NoBL™ Architecture Features • Pin-compatible and functionally equivalent to ZBT™ •

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CC1354P10 SWRS267B – DECEMBER 2022 – REVISED DECEMBER 2023 CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplif

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Datasheet R8C/35C Group RENESAS MCU R01DS0006EJ0100 Rev 1.00 Aug. 24, 2010 1. Overview 1.1 Features The R8C/35C Group of single-chip MCUs incorpor

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CY7C1354C CY7C1356C 9-Mbit (256K × 36/512K × 18) Pipelined SRAM with NoBL™ Architecture 9-Mbit (256K × 36/512K × 18) Pipelined SRAM with NoBL™ Archit

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CY7C1354D 9-Mbit (256K × 36) Pipelined SRAM with NoBL™ Architecture 9-Mbit (256K × 36) Pipelined SRAM with NoBL™ Architecture Features ■ Pin-compatib

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W91350N SERIES 13-MEMORY TONE/PULSE DIALER WITH HANDFREE AND HOLD FUNCTIONS GENERAL DESCRIPTION The W91350N series are tone/pluse switchable telephon

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MITSUMI Q Xpander Processors MM1326, 1354, 1369 . U Monolithic IC MM1326, 1354, 1369 4 t e e h S Outline a at .D w w w Features Q Xpander Processor

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CY7C1354CV25 CY7C1356CV25 9-Mbit (256K × 36/512K × 18) Pipelined SRAM with NoBL™ Architecture 9-Mbit (256K × 36/512K × 18) Pipelined SRAM with NoBL™

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03/11/2004 RELIABILITY REPORT FOR DS21354, Rev B2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel

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MITSUMI Q Xpander Processors MM1326, 1354, 1369 . U Monolithic IC MM1326, 1354, 1369 4 t e e h S Outline a at .D w w w Features Q Xpander Processor

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Data Sheet No. PD10049-D Series PVA13N Microelectronic Power IC HEX.ET® Power MOS.ET Photovoltaic Relay Single-Pole, Normally-Open, 0-100V AC/DC, 37

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