FM0 Datasheet | Specifications & PDF Download

Application Notice 1. Delta will not guarantee the performance of the products if the application condition falls outside the parameters set forth in

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Surface Mount Multilayer Power Inductor FEATURES • 0805 AND 0806 CASE SIZES • HIGH DC CURRENT AND LOW DC RESISTANCE • REFLOW SOLDERING APPLICABLE • P

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Surface Mount Multilayer Power Inductor FEATURES • 0805 AND 0806 CASE SIZES • HIGH DC CURRENT AND LOW DC RESISTANCE • REFLOW SOLDERING APPLICABLE • P

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EM47FM0888MBA 4Gb (64M×8Bank×8) Double DATA RATE 3 low voltage SDRAM Features • JEDEC Standard VDD/VDDQ = 1.35V(1.283-1.45V) • All inputs and outputs

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Surface Mount Multilayer Power Inductor FEATURES • 0805 AND 0806 CASE SIZES • HIGH DC CURRENT AND LOW DC RESISTANCE • REFLOW SOLDERING APPLICABLE • P

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Surface Mount Multilayer Power Inductor FEATURES • 0805 AND 0806 CASE SIZES • HIGH DC CURRENT AND LOW DC RESISTANCE • REFLOW SOLDERING APPLICABLE • P

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Low Noise/Medium Power GaAs MESFET Chip AFM04P3-000 Features s 21 dBm Output Power @ 18 GHz s High Associated Gain, 9 dB @ 18 GHz s High Power Added E

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PD-90708D IRFM044 POWER MOSFET THRU-HOLE (TO-254AA) Product Summary Part Number RDS(on) IRFM044 0.04 ID 35A* 60V, N-CHANNEL HEXFET MOSFET TECH

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Surface Mount Multilayer Power Inductor FEATURES • 0805 AND 0806 CASE SIZES • HIGH DC CURRENT AND LOW DC RESISTANCE • REFLOW SOLDERING APPLICABLE • P

(20 views)

Surface Mount Multilayer Power Inductor FEATURES • 0805 AND 0806 CASE SIZES • HIGH DC CURRENT AND LOW DC RESISTANCE • REFLOW SOLDERING APPLICABLE • P

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Surface Mount Multilayer Power Inductor FEATURES • 0805 AND 0806 CASE SIZES • HIGH DC CURRENT AND LOW DC RESISTANCE • REFLOW SOLDERING APPLICABLE • P

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Surface Mount Multilayer Power Inductor FEATURES • 0805 AND 0806 CASE SIZES • HIGH DC CURRENT AND LOW DC RESISTANCE • REFLOW SOLDERING APPLICABLE • P

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IRFM054 MECHANICAL DATA Dimensions in mm (inches) 13.59 (0.535) 13.84 (0.545) 3.53 (0.139) Dia. 3.78 (0.149) 6.32 (0.249) 6.60 (0.260) 1.02 (0.040) 1

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Surface Mount Multilayer Power Inductor FEATURES • 0805 AND 0806 CASE SIZES • HIGH DC CURRENT AND LOW DC RESISTANCE • REFLOW SOLDERING APPLICABLE • P

(19 views)

Surface Mount Multilayer Power Inductor FEATURES • 0805 AND 0806 CASE SIZES • HIGH DC CURRENT AND LOW DC RESISTANCE • REFLOW SOLDERING APPLICABLE • P

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Filters for Communication Equipment Part Number Nominal Center Bandwidth Frequency (fo) (BW) (MHz) (MHz) Insertion Loss in BW (dB) Balance Impe

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Surface Mount Multilayer Power Inductor FEATURES • 0805 AND 0806 CASE SIZES • HIGH DC CURRENT AND LOW DC RESISTANCE • REFLOW SOLDERING APPLICABLE • P

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Surface Mount Multilayer Power Inductor FEATURES • 0805 AND 0806 CASE SIZES • HIGH DC CURRENT AND LOW DC RESISTANCE • REFLOW SOLDERING APPLICABLE • P

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Surface Mount Multilayer Power Inductor FEATURES • 0805 AND 0806 CASE SIZES • HIGH DC CURRENT AND LOW DC RESISTANCE • REFLOW SOLDERING APPLICABLE • P

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