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IRF Matched Datasheet



Part Number Description Manufacture
IRF3205
N-Channel Trench Process Power MOSFET Transistor

● VDS=55V; ID=105A@ VGS=10V; RDS(ON)6.0mΩ @ VGS=10V
● Ultra Low On-Resistance
● High UIS and UIS 100% Test Application
● Hard Switched and High Frequency Circuits
● Uninterruptible Power Supply
● Inverter Application G DS TO-220CB Top View Schemat
Manufacture
Thinki Semiconductor
IRFZ44N
N-Channel MOSFET Transistor

·Drain Current
  –ID=49A@ TC=25℃
·Drain Source Voltage- : VDSS= 55V(Min)
·Static Drain-Source On-Resistance : RDS(on) = 0.032Ω(Max)
·Fast Switching DESCRIPTION
·Designed for low voltage, high speed switching applications in power supplies, converters
Manufacture
INCHANGE
IRF3710
Power MOSFET
C = 25°C VGS IAR EAR dv/dt TJ TSTG Parameter Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current  Power Dissipation Linear Derating Factor Gate-to-Source Voltage Avalanche Current Repetitive Avalanche Energ
Manufacture
International Rectifier
IRFZ44
N-Channel Trench Power MOSFETs

● VDS=60V;ID=45A@ VGS=10V; RDS(ON)7.5mΩ @ VGS=10V
● Ultra Low On-Resistance
● High UIS and UIS 100% Test Application
● Hard Switched and High Frequency Circuits
● Uninterruptible Power Supply G DS TO-251 Top View Schematic Diagram VDSS = 60 V IDS
Manufacture
Thinki Semiconductor
IRFB4310
HEXFET Power MOSFET
Avalanche Characteristics EAS (Thermally limited) IAR EAR eSingle Pulse Avalanche Energy ÙAvalanche Current gRepetitive Avalanche Energy Thermal Resistance Symbol RθJC Parameter kJunction-to-Case RθCS RθJA RθJA Case-to-Sink, Flat Greased Su
Manufacture
International Rectifier
FB31N20D
IRFB31N20D
Units A W W/°C V V/ns °C Typical SMPS Topologies l Telecom 48V Input Forward Converters Notes  through ‡ are on page 11 www.irf.com 1 2/14/00 IRFB/IRFS/IRFSL31N20D Static @ TJ = 25°C (unless otherwise specified) Parameter Drain-to-Source Bre
Manufacture
International Rectifier
IRFP460
N-Channel Power MOSFET

• 20A, 500V
• rDS(ON) = 0.270Ω
• Single Pulse Avalanche Energy Rated
• SOA is Power Dissipation Limited
• Nanosecond Switching Speeds
• Linear Transfer Characteristics
• High Input Impedance
• Related Literature - TB334 “Guidelines for Soldering Surf
Manufacture
Intersil Corporation
F9530N
IRF9530N
C = 25°C VGS EAS IAR EAR dv/dt TJ TSTG Continuous Drain Current, VGS @ -10V Continuous Drain Current, VGS @ -10V Pulsed Drain Current  Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy‚ Avalanche Current
Manufacture
International Rectifier
IRFP260M
N-Channel MOSFET

·Static drain-source on-resistance: RDS(on)≤40mΩ
·Enhancement mode:
·100% avalanche tested
·Minimum Lot-to-Lot variations for robust device performance and reliable operation
·DESCRITION
·High Speed Power Switching
·ABSOLUTE MAXIMUM RATINGS(Ta=25℃)
Manufacture
INCHANGE
IRF840
N-Channel Power MOSFET
se R ӨJA Thermal Resistance, Junction to Ambient PD Total Power Dissipation at Tc=25¥ Notes Rating IRF440/442 IRF840/842 MTM7N50 500 500 ±20 -50 to +150 275 IRF440/441 IRF840/841 0.85 8 32 1.0 60 125 IRF442/443 IRF842/843 1.1 7 28 1.0 60 125
Manufacture
ART CHIP

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