LQFP-64 Datasheet | Specifications & PDF Download

64-Lead Low-Profile Plastic Quad Flat Pack Package (CFA) -10x10 mm Body [LQFP] With 6.2x6.2 mm Exposed Pad and 2.0 mm Foot Print; Micrel Legacy Note:

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P/PG-LQFP-64-6, -8, -12, -19, -22 Package Outline 0.1±0.05 STAND OFF 1.4 ±0.05 1.6 MAX. 0.15 -+0.0.0065 0° 7° 15 x 0.5 = 7.5 H 0.5 0.2 +0.07 -

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Pin Assignment / / TX_CLK MODE0 TXD[3] TXD[2] TXD[1] 50 64 RESET VCC GND CLOCK A[14]/DA[6] A[13]/DA[5] A[12]/DA[4] A[11]/DA[3] A[10]/DA[2] A[9]/

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INTEGRATED CIRCUITS 80C554/83C554/87C554 80C51 8-bit microcontroller – 6 clock operation 16K/512 OTP/ROM/ROMless, 7 channel 10 bit A/D, I2C, PWM, cap

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Package Information 64-pin LQFP (7mm × 7mm) Outline Dimensions C D 4 8 3 3 G H I 4 9 3 2 F A B E 6 4 1 7 K 1 1 6 = J Symbol A B C D E F G H I J

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PCB-LQFP64 QFP64 / LQFP64 / TQFP64 SMD Adapter Board (0.5mm pitch) Description The PCB-LQFP64 adapter module is designed to convert integrated circuit

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Additional Information, DS3, Nov. 2008 Recommendations for Printed Circuit Board Assembly of Infineon PG-LQFP-64-6, -8 -11/ PG-LQFP-100-2/PG-LQFP-100-

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Additional Information, DS3, Nov. 2008 Recommendations for Printed Circuit Board Assembly of Infineon PG-LQFP-64-6, -8 -11/ PG-LQFP-100-2/PG-LQFP-100-

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LQFP64 SOT1699-1 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body 22 November 2019 Package

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Additional Information, DS3, Nov. 2008 Recommendations for Printed Circuit Board Assembly of Infineon PG-LQFP-64-6, -8 -11/ PG-LQFP-100-2/PG-LQFP-100-

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Additional Information, DS3, Nov. 2008 Recommendations for Printed Circuit Board Assembly of Infineon PG-LQFP-64-6, -8 -11/ PG-LQFP-100-2/PG-LQFP-100-

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Pin Assignment / / TX_CLK MODE0 TXD[3] TXD[2] TXD[1] 50 64 RESET VCC GND CLOCK A[14]/DA[6] A[13]/DA[5] A[12]/DA[4] A[11]/DA[3] A[10]/DA[2] A[9]/

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P/PG-LQFP-64-4, -5, -13 Package Outline 1.6 MAX. 1.4 ±0.05 0.1 ±0.05 0.15 -0.06 +0.05 +0.07 H 0.6 ±0.15 0.2 -0.03 0.5 7.5 C 0.08 C 64x 0.08 M

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P/PG-LQFP-64-4, -5, -13 Package Outline 1.6 MAX. 1.4 ±0.05 0.1 ±0.05 0.15 -0.06 +0.05 +0.07 H 0.6 ±0.15 0.2 -0.03 0.5 7.5 C 0.08 C 64x 0.08 M

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Additional Information, DS3, Nov. 2008 Recommendations for Printed Circuit Board Assembly of Infineon PG-LQFP-64-6, -8 -11/ PG-LQFP-100-2/PG-LQFP-100-

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PACKAGE DIMENSIONS LQFP64-H2 １ ２± ０ ． １ １ ０± ０ ． １ ４８ ３３ ° ０ ～ １ ０ ４９ ３２ １ ０ ± ０ ． １ １ ２ ± ０ ． １ ６４ １ ０ ． ５ １６ １７ ０ ． ２ ±０ ． １ ± ０ ． ０ ５ １ ． ４

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P/PG-LQFP-64-4, -5, -13 Package Outline 1.6 MAX. 1.4 ±0.05 0.1 ±0.05 0.15 -0.06 +0.05 +0.07 H 0.6 ±0.15 0.2 -0.03 0.5 7.5 C 0.08 C 64x 0.08 M

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Additional Information, DS3, Nov. 2008 Recommendations for Printed Circuit Board Assembly of Infineon PG-LQFP-64-6, -8 -11/ PG-LQFP-100-2/PG-LQFP-100-

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Package dimensions LQFP64-P-1010-0.50E Unit:mm Before creating and producing designs and using, customers must also refer to and comply with the l

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Plastic Packages for Integrated Circuits Low Plastic Quad Flatpack Packages (LQFP) D D1 -D- -A- -B- E E1 PIN 1 -H- GAGE PLANE 0.020 0.008 MIN 0

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