CYStech Electronics Corp.
Spec. No. : C016J3
Issued Date : 2018.04.11
Revised Date : 2018.04.12
Page No. : 2/ 9
Absolute Maximum Ratings (TC=25°C)
Drain-Source Voltage (Note 1)
Continuous Drain Current @TC=25°C, VGS=10V
Continuous Drain Current @TC=100°C, VGS=10V
Continuous Drain Current @TA=25°C, VGS=10V
Continuous Drain Current @TA=70°C, VGS=10V
Pulsed Drain Current @ VGS=10V
Single Pulse Avalanche Energy @ L=0.1mH, ID=32A, VDD=30V
Repetitive Avalanche Energy
Operating Junction and Storage Temperature
Thermal Resistance, Junction-to-case, max
Thermal Resistance, Junction-to-ambient, max
50 (Note 4)
Note : 1.The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful
in setting the upper dissipation limit for cases where additional heatsinking is used.
2. The power dissipation PDSM is based on RθJA and the maximum allowed junction temperature of 150°C. The value in
any given application depends on the user’s specific board design.
3. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency
and low duty cycles to keep initial TJ=25°C.
4. When the device is mounted on 1 in²FR-4 board with 2 oz. copper, in a still air environment with TA=25°C. The value in any
given application depends on the user’s specific board design.
5. 100% tested by conditions of L=0.1mH, VGS=10V, IAS=10A, VDD=30V
CYStek Product Specification