CYStech Electronics Corp.
Spec. No. : C091J3
Issued Date : 2015.10.07
Revised Date : 2015.10.13
Page No. : 2/9
Absolute Maximum Ratings (TC=25°C, unless otherwise noted)
Continuous Drain Current @TC=25°C, VGS=-10V
Continuous Drain Current @TC=100°C, VGS=-10V
Continuous Drain Current @TA=25°C, VGS=-10V
Continuous Drain Current @TA=70°C, VGS=-10V
Pulsed Drain Current
Avalanche Energy @ L=10mH, ID=-3.2A, VDD=-50V
Total Power Dissipation
Operating Junction and Storage Temperature Range
* 100% UIS testing in condition of VDD=-50V, L=10mH, VG=-10V, IAS=-3.2A, Rated VDS=-250V
Thermal Resistance, Junction-to-case
Thermal Resistance, Junction-to-ambient, t≤10s (Note 2)
Thermal Resistance, Junction-to-ambient, steady state (Note 2)
Note : 1.The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful
in setting the upper dissipation limit for cases where additional heatsinking is used.
2. The value of RθJA is measured with the device mounted on 1 in²FR-4 board with 2 oz. copper, in a still air environment
with TA=25°C. The power dissipation PDSM is based on RθJA and the maximum allowed junction
temperature of 150°C. The value in any given application depends on the user’s specific board design.
3. Pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and low duty cycles
to keep initial TJ=25°C.
CYStek Product Specification