DDTC123JLP
Overview
- Epitaxial Planar Die Construction Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes Lead Free By Design/RoHS Compliant (Note 1) "Green" Device (Note 2) 2 3 1 3 2 E B C R1 R2 1 Mechanical Data * * * * * * *
- Case: DFN1006-3 Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020C Terminal Connections: Collector Dot (See Diagram) Terminals: Finish ⎯ NiPdAu annealed over Copper leadframe. Solderable per MIL-STD-202, Method 208 Marking Information: See Page 6 Ordering Information: See Page 6 Weight: 0.001 grams (approximate) Component P/N DDTC123JLP DDTC143ZLP DDTC114YLP R1(NOM) 2.2K 4.7K 10K R2(NOM) 47K 47K 47K C 3 Fig. 1 OUT IN 1 B IN E B 1 2 E C 3 OUT R1 R2 GND 2 GND Equivalent Inverter Circuit Schematic and Pin Configuration Fig. 2 Figure 2 2 2
