z Silicon Chip on Direct-Copper Bond (DCB) Substrate z Isolated Mounting Surface z 2500V~ Electrical Isolation Advantages z High Power Density z Low Gate Drive Requiremen.

z Power Inverters z UPS z Motor Drives z SMPS z PFC Circuits z Welding Machines © 2010 IXYS CORPORATION, All Rights Res.

High Voltage IGBT

IXGR60N60B2

IXGR60N60B2D1

IXGR60N60C2

IXGR60N60C2D1

IXGR60N60C3C1

IXGR60N60C3D1

IXGR60N60U1

IXGR64N60A3

IXGR120N60B

IXGR120N60C2

IXGR16N170AH1

IXGR24N120C3D1

IXGR24N60C

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