GWM180-004X2 Overview
Key Features
- MOSFETs in trench technology
- optimized intrinsic reverse diode
- high level of integration
- high current capability 300 A max
- aux. terminals for MOSFET control
- terminals for soldering or welding connections
- isolated DCB ceramic base plate with optimized heat transfer
- Space and weight savings Package options
- 2 lead forms available
- straight leads (SL)
