* CoolSiC (TM) Schottky diode gen 5
* Increased blocking voltage capability up to 650V
* Low inductive design
* Low switching losses Mechanical Features
* Al2O3 substrate with low thermal resistance
* Integrated NTC temperature sensor
* Solder
DF100R07W1H5FP_B54 Datasheet (699.58 KB)
DF100R07W1H5FP_B54
699.58 KB
Igbt.
DF100R07W1H5FP_B54 EasyPACK™ Modul mit TRENCHSTOP™ 5 H5 und CoolSiC™ Diode und PressFIT / bereits aufgetragenem Thermal Interface Material EasyPACK™ m.
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